STMicroelectronics

ST4SIM-300M - GSMA IoT eSIM

ST4SIM-300M
简化面向物联网蜂窝设备的 eSIM 生态系统
ST4SIM-300M - GSMA IoT eSIM

Description

The ST4SIM-300M is an STMicroelectronics top-class GSMA embedded SIM (eSIM or eUICC) product designed for all IoT devices. It complies with the GSM Association (GSMA) specification SGP.32 v1.2.

The ST4SIM-300M can remotely manage profiles of different MNOs while ensuring the appropriate security level to all eUICC stakeholders (user, MNO, OEM, hardware integrator, service provider, and so on). The device can include an embedded secure element to store credentials and/or independent applications directly managed by the MCU (or by another OEM element). It provides a secure and interoperable Java® Card environment compliant with Java® Card v. 3.0.5 Classic. Moreover, the device integrates the most advanced UICC features compliant with GlobalPlatform®, ETSI, 3GPP, 3GPP2 specifications.

The ST4SIM-300M integrates a dynamic memory management with Java® Card garbage collection mechanism, optimizing the memory usage. The ST4SIM-300M is based on the ST33K1M5M, an industrial-grade hardware solution (JEDEC) supporting severe conditions. This solution is a tamper-resistant secure element certified by Common Criteria EAL6+, with a powerful 32-bit Arm® Cortex®-M35P CPU.
 

All Features

  • Remote SIM provisioning compliant with GSMA eSIM for IoT and TCA specifications
  • Bootstrap connectivity profile provided by a trusted partner
  • Compliant with 4G (LTE) / CDMA / NB-IOT / CAT–M networks
  • Network access applications supported: SIM / USIM / ISIM / CSIM
  • Secure element access control (ARF / PKCS#15)
  • OTA capability over SMS, CAT-TP and HTTPS (including DNS)
  • Multi-Interfaces able to combine eSIM + eSE
 
  • Hardware
    • Product available on ST33K1M5M
    • ST33 product based on a 32-bit Arm® Cortex®-M35P CPU core
    • Supply voltage: Supply voltage ranges: 1.8 V, 3 V
    • Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol)
    • Serial peripheral interface (SPI) or I2C, depending on packages
    • Industrial qualification (JEDEC JESD47)
    • Operating temperature: -40°C to +105°C
    • Common Criteria EAL6+
  • ECOPACK-compliant packages
    • Card plugin 2FF, 3FF, or 4FF
    • VFDFPN8 5 × 6 mm, wettable flank (MFF2)
    • WLCSP24
  • Security
    • Symmetric cryptography DES / 3DES / AES
    • Asymmetric cryptography RSA (up to 2048 bits)
    • HTTPS remote management TLS v1.0, v1.1 and v1.2
    • Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpoolP256r1
    • Authentication algorithm: MILENAGE, TUAK, CAVE and XOR
  • Software standard compliancy
    • GSMA SGP.32 v1.2
    • TCA interoperable profile v3.3.1
    • Java® Card v3.0.5 Classic
    • GlobalPlatform® card specification v2.3, including amendments B, C, D, F, and H
    • GlobalPlatform® enhancement with SCP11, ELF upgrade
    • OS update mechanism
    • ETSI, 3GPP and 3GPP2 release 17 (API Rel16)
    • Power saving features (PSM & eDRX) defined by ETSI release 17
     

Resource


*STMicroelectronics Authorized Distributor
 
twL_marqueepic_22G06_3RNAyzuHfs
订阅电子报,掌握最新科技与产业趋势
订阅电子报,掌握最新科技与产业趋势
我要订阅

數字驗證

請由小到大,依序點擊數字

洽詢車

你的洽詢車總計 0 件產品

    搜索

    偵測到您已關閉Cookie,為提供最佳體驗,建議您使用Cookie瀏覽本網站以便使用本站各項功能

    本网站使用Cookie为您提供最佳的使用体验。继续使用本网站,即表示您同意我们的Cookie Policy。